Clock tree routing in a chip stack

ABSTRACT

Examples described herein generally relate to clock tree routing in a chip stack. In an example, a multi-chip device includes a chip stack. The chip stack includes chips. The chip stack includes a clock tree. In-chip routing of the clock tree is contained within one logical chip of the chip stack. The chip stack includes leaf nodes disposed in respective chips. Each leaf node of the leaf nodes is electrically connected to the clock tree through a respective leaf-level connection bridge. The respective leaf-level connection bridge extends in an out-of-chip direction through a plurality of the chips.

TECHNICAL FIELD

Examples of the present disclosure generally relate to clock treerouting in a chip stack.

BACKGROUND

Apparatuses, including modules and/or packages, that include multipleintegrated circuit chips have been developed. The forms of suchapparatuses are varied. By forming such apparatuses, an electronicdevice can integrate multiple chips to form the device, where each chipcan be manufactured using standard semiconductor processing to then beassembled and packaged to form a larger, multi-functional device. Byhaving different chips, in some instances, semiconductor processing thatis difficult to integrate can be separated, such as when parts of onechip require a different process from another chip.

Another aspect is an ability to build a device having chips withdifferent functionalities (for example, some are field programmable gatearray (FPGA) chips and some are memory chips) into a same apparatus witha smaller device size and more functionality and lower power.Semiconductor processes for a chip can be more focused to give devices agreater edge in areas such as increased performance of the chip, reducedcosts, and increased yield in manufacturing. Other benefits can berealized by such apparatuses.

SUMMARY

Examples described herein generally relate to clock tree routing in achip stack. Generally, in-chip routing of a clock tree in a chip stackthat includes multiple chips is contained within one logical chip of thechip stack. According to some examples, having in-chip routing containedwithin one logical chip can reduce skew of a clock signal received atleaf nodes on different chips because skew from inter-wafer variationcan be avoided by having the in-chip routing contained within onelogical chip.

An example described herein is a multi-chip device. The multi-chipdevice includes a chip stack. The chip stack includes chips. The chipstack includes a clock tree. In-chip routing of the clock tree iscontained within one logical chip of the chip stack. The chip stackincludes leaf nodes disposed in respective chips. Each leaf node of theleaf nodes is electrically connected to the clock tree through arespective leaf-level connection bridge. The respective leaf-levelconnection bridge extends in an out-of-chip direction through aplurality of the chips.

Another example described herein is a multi-chip device. The multi-chipdevice includes a chip stack. The chip stack includes chips. The chipstack includes a programmable clock routing network. Programmableleaf-level connection bridges are disposed in the chip stack andelectrically connected to the programmable clock routing network. Theprogrammable leaf-level connection bridges extend in an out-of-chipdirection through a plurality of the chips and are electricallyconnected to respective leaf nodes in each chip of the plurality of thechips.

Another example described herein is a method of operating a multi-chipdevice. A clock signal is propagated along a clock tree in a chip stack.The chip stack includes chips. In-chip routing of the clock tree iscontained within one logical chip of the chip stack. The chip stackincludes leaf nodes disposed in respective chips. Each leaf node of theleaf nodes is electrically connected to the clock tree through arespective leaf-level connection bridge. The respective leaf-levelconnection bridge extends in an out-of-chip direction through aplurality of the chips.

These and other aspects may be understood with reference to thefollowing detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features can be understoodin detail, a more particular description, briefly summarized above, maybe had by reference to example implementations, some of which areillustrated in the appended drawings. It is to be noted, however, thatthe appended drawings illustrate only typical example implementationsand are therefore not to be considered limiting of its scope.

FIG. 1 is a structure of a multi-chip device having a chip stackaccording to some examples.

FIG. 2 is a block diagram of a circuit schematic depicting integratedcircuits of the chip stack of the multi-chip device of FIG. 1 accordingto some examples.

FIG. 3 is a block diagram depicting a fabric chip comprising aprogrammable logic (PL) integrated circuit (IC) according to someexamples.

FIG. 4 is a block diagram depicting programmable logic elements andprogrammable interconnect elements according to some examples.

FIG. 5 illustrates aspects of a tier of an in-chip programmable clockrouting network in a PL IC according to some examples.

FIG. 6 is a schematic of out-of-chip routing to route clock signalsout-of-chip according to some examples.

FIG. 7 illustrates aspects of a tier of an in-chip programmable clockrouting network in a clock region according to some examples.

FIG. 8 shows a schematic of a leaf-level connection bridge electricallyconnected to a programmable clock routing network in a chip stackaccording to some examples.

FIG. 9 depicts clock trees in a chip stack according to some examples.

FIG. 10 is a schematic of out-of-chip routing bridges in a chip stackaccording to some examples.

FIG. 11 depicts a clock tree in a chip stack according to some examples.

FIG. 12 is a flowchart of a method of forming the multi-chip device ofFIG. 1 according to some examples.

FIG. 13 is a flowchart of a method of operating a multi-chip deviceaccording to some examples.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements of one example may bebeneficially incorporated in other examples.

DETAILED DESCRIPTION

Examples described herein generally relate to clock tree routing in achip stack. Generally, in-chip routing of a clock tree in a chip stackthat includes multiple chips is contained within one logical chip of thechip stack. Conceptually, one logical chip is a collection of portionsof one or more physical chips that, when operably electrically connectedtogether, are capable of operating in a manner that is indistinguishablefrom operation of one physical chip from an end user's perspective. Forexample, in-chip routing of a clock tree to leaf level(s) is containedwithin one logical chip when, from a branching point (if any) of theclock tree, all of the branches of the clock tree have correspondingin-chip routing within a same physical chip to out-of-chip routing (ifany) that are at respective generally same in-chip locations within thatphysical chip, and from that out-of-chip routing, corresponding in-chiprouting of all of the branches is within another same physical chip,which out-of-chip routing can occur any number of times at respectivein-chip locations with subsequent corresponding in-chip routing of allof the branches being within a same physical chip until the leaflevel(s) are reached. Once the clock tree reaches the leaf level, leafnodes are electrically connected to the clock tree through out-of-chipleaf-level connection bridges that extend through chips of the chipstack. According to some examples, having in-chip routing containedwithin one logical chip can reduce skew of a clock signal received atleaf nodes on different chips because skew from inter-wafer variationcan be avoided by having the in-chip routing contained within onelogical chip.

Examples can be implemented in hardwired and/or non-programmable clocktrees, such as in application specific integrated circuits (ASICs).Examples, such as described below, can be implemented using aprogrammable clock routing network. A person having ordinary skill inthe art will readily understand how aspects described below areapplicable to various examples.

Various features are described hereinafter with reference to thefigures. It should be noted that the figures may or may not be drawn toscale and that the elements of similar structures or functions arerepresented by like reference numerals throughout the figures. It shouldbe noted that the figures are only intended to facilitate thedescription of the features. They are not intended as an exhaustivedescription of the claimed invention or as a limitation on the scope ofthe claimed invention. In addition, an illustrated example need not haveall the aspects or advantages shown. An aspect or an advantage describedin conjunction with a particular example is not necessarily limited tothat example and can be practiced in any other examples even if not soillustrated or if not so explicitly described. Further, methodsdescribed herein may be described in a particular order of operations,but other methods according to other examples may be implemented invarious other orders (e.g., including different serial or parallelperformance of various operations) with more or fewer operations.Various components described as a “first”, “second”, etc. of thecomponent does not connote or imply any structure or position resultingfrom the “first”, “second”, etc. “First”, “second”, etc. are used hereinto easily refer to different components.

In the description that follows, various signals or data may bedescribed in the context of the operation of various circuits. Adescribed signal or data indicates a corresponding node on which thesignal or data is applied or propagated and further indicates nodes thatare communicatively coupled and/or electrically connected. For example,description of a signal or data output from a first circuit and input toa second circuit indicates an output node of the first circuit (on whichthe signal or data is output from the first circuit) is communicativelycoupled and/or electrically connected to an input node of the secondcircuit (on which the signal or data is input to the second circuit).Explicit description of such nodes may be omitted in the followingdescription, but a person having ordinary skill in the art will readilyunderstand the presence of the nodes.

FIG. 1 is a structure of a multi-chip device according to some examples.The multi-chip device of FIG. 1 includes a chip stack that includes abase chip 102 and fabric chips 104, 106, 108. The base chip 102 andfabric chips 104-108 are described herein as examples. Although thedifferent chips are described herein as being or including variousintegrated circuits (ICs) or components (e.g., fabric, base,programmable logic, etc.), aspects described herein can be generallyapplicable to chips of a multi-chip device having any type of IC orcomponent.

In the multi-chip device of FIG. 1, the fabric chips 104-108 arearranged active or front side facing down towards the base chip 102,where the base chip 102 is arranged active or front side facing uptowards the fabric chips 104-108. In other multi-chip devices,intermediate fabric chips are arranged active or front side facing upaway from the base chip 102, and a distal fabric chip is arranged activeor front side facing down towards the base chip 102, where the base chip102 is arranged active or front side facing up towards the fabric chips104-108. Various other multi-chip devices can have different structures,different number of chips, additional components, etc.

Generally, the chips 102-108 are stacked and form a chip stack in themulti-chip device. The chips 102-108 are stacked to form, in someexamples, an Active die-on-Active die (AoA) device. Each of the chips102-108 can include an active IC. In some examples, more or fewer chipscan be included in the chip stack. For example, a multi-chip device canhave two chips, such as a base chip and a fabric chip, or two fabricchips. In other examples, a multi-chip device can have three chips, fourchips, five chips, etc.

Each of the chips 102-108 includes a respective semiconductor substrate112, 114, 116, 118 and respective front side dielectric layer(s) 122,124, 126, 128 on a front side of the respective semiconductor substrate112-118. The front side dielectric layer(s) 122-128 includemetallization (e.g., metal lines and/or vias) (illustrated but notspecifically numbered) formed therein which can electrically connectvarious components in an IC. Each of the chips 102-106 includesrespective backside dielectric layer(s) 132, 134, 136 on a backside ofthe respective semiconductor substrate 112-116. The backside dielectriclayer(s) 132-136 include metallization (e.g., metal lines and/or vias)(illustrated but not specifically numbered) formed therein which canelectrically connect various components in an IC. Metallization in frontside dielectric layer(s) 124, 126, 128 of the fabric chips 104, 106, 108electrically connect to respective circuit regions of the fabric chips104, 106, 108 in which respective active circuits can be formed.

Each semiconductor substrate 112-118 of the chips 102-108 includes,e.g., a transistor 142, 144, 146, 148 formed on and/or in the front sidesurface of the respective semiconductor substrate 112-118. Thetransistor 142-148 and any other components can be connected to themetallization in the front side dielectric layer(s) 122-128. Eachsemiconductor substrate 112-116 of the respective chip 102-106 hasbackside through-substrate via(s) (TSV(s)) 162, 164, 166 therethrough,which can electrically connect the metallization in the front sidedielectric layer(s) 122-126 to the metallization in the backsidedielectric layer(s) 132-136 of the respective chip 102-106.

Front side bond pads 152, 154, 156, 158 (e.g., metal (e.g., Cu) bondpads) are formed in the respective front side dielectric layer(s)122-128 of the chips 102-108 at an exterior surface distal from therespective semiconductor substrate 112-118. The front side bond pads152-158 can be in an arrangement that forms a respective chip-to-chipinterface. The front side bond pads 152-158 are connected to themetallization in the respective front side dielectric layer(s) 122-128.Backside bond pads 174, 176 (e.g., metal (e.g., Cu) bond pads) areformed in the respective backside dielectric layer(s) 134, 136 of thefabric chips 104, 106 at an exterior surface distal from the respectivesemiconductor substrate 114, 116. The backside bond pads 174, 176 can bein an arrangement that forms a respective chip-to-chip interface. Thebackside bond pads 174, 176 are connected to the metallization in therespective backside dielectric layer(s) 134, 136.

Exterior connector backside pads 172 (e.g., metal (e.g., aluminum) pads)are formed in the backside dielectric layer(s) 132 of the base chip 102at an exterior surface distal from the semiconductor substrate 112 ofthe base chip 102. The exterior connector backside pads 172 areconnected to the metallization in the backside dielectric layer(s) 132of the base chip 102. A passivation layer 180 is formed on the exteriorsurface distal from the semiconductor substrate 112 of the base chip 102with respective openings therethrough exposing the exterior connectorbackside pads 172. External connectors 182 (e.g., controlled collapsechip connections (C4), minibumps, etc.) are formed on respectiveexterior connector backside pads 172 through the openings in thepassivation layer 180.

The external connectors 182 can be attached to a package substrate. Thepackage substrate may further be attached to, e.g., a printed circuitboard (PCB) to attach the package substrate (and hence, the multi-chipdevice) to the PCB. Various other components can be included in amulti-chip device. For example, an interposer, an encapsulant (such as amolding compound (MUF) or the like), etc. can be included in themulti-chip device. A person having ordinary skill in the art willreadily envision various modifications that can be made to themulti-chip device.

The chips 102-108 are bonded (e.g., by hybrid bonding usingmetal-to-metal and oxide-to-oxide bonding) together to form a chipstack. The base chip 102 is bonded to the fabric chip 104 front side tofront side such that the front side bond pads 152 and exterior surfaceof the front side dielectric layer(s) 122 of the base chip 102 arebonded to the front side bond pads 154 and exterior surface of the frontside dielectric layer(s) 124 of the fabric chip 104. The fabric chip 104is bonded to the fabric chip 106 backside to front side such that thebackside bond pads 174 and exterior surface of the backside dielectriclayer(s) 134 of the fabric chip 104 are bonded to the front side bondpads 156 and exterior surface of the front side dielectric layer(s) 126of the fabric chip 106. The fabric chip 106 is bonded to the fabric chip108 backside to front side such that the backside bond pads 176 andexterior surface of the backside dielectric layer(s) 136 of the fabricchip 106 are bonded to the front side bond pads 158 and exterior surfaceof the front side dielectric layer(s) 128 of the fabric chip 108.

Other arrangements of bonding can be implemented. For example, the basechip 102 can be bonded to the fabric chip 104 front side to backsidesuch that the front side bond pads 152 and exterior surface of the frontside dielectric layer(s) 122 of the base chip 102 are bonded to thebackside bond pads 174 and exterior surface of the backside dielectriclayer(s) 134 of the fabric chip 104. The fabric chip 104 can be bondedto the fabric chip 106 front side to backside such that the front sidebond pads 154 and exterior surface of the front side dielectric layer(s)124 of the fabric chip 104 are bonded to the backside bond pads 176 andexterior surface of the backside dielectric layer(s) 136 of the fabricchip 106. The fabric chip 106 can be bonded to the fabric chip 108 frontside to front side such that the front side bond pads 156 and exteriorsurface of the front side dielectric layer(s) 126 of the fabric chip 106are bonded to the front side bond pads 158 and exterior surface of thefront side dielectric layer(s) 128 of the fabric chip 108.

In other examples, the chips 102-108 can be attached together usingexternal connectors (such as minibumps, solder, etc.). In some examples,some of the chips 102-108 can be attached together by externalconnectors while others of the chips can be bonded together without useof external connectors. Any permutation of bonding and use of externalconnectors can be implemented.

In some examples, each of the fabric chips 104-108 includes a processingIC. A processing IC can generally include any circuit configured to orconfigurable to process any data and/or signal and output data and/or asignal resulting from that processing, and is more than merely memoryand any circuit ancillary to memory (e.g., address decoder, memorycontroller, etc.). The processing IC of the fabric chips 104-108 isgenerally a same IC. The hardware topology, architecture, and layout ofthe fabric chips 104-108 can be the same in some examples, except thatthe distal fabric chip 108 may omit components formed by backsideprocessing, such as backside TSVs, backside dielectric layer(s), and/ormetallization in backside dielectric layer(s). In some examples, theprocessing IC of the fabric chips 104-108 includes one or moreprogrammable logic regions (e.g., fabric of a FPGA), which has the samehardware topology, architecture, and layout between the fabric chips104-108. Having Z-interfaces in the fabric chips 104-108 can permitchips undergoing a same front side processing to be integrated in amulti-chip device.

In other examples, the chips 102-108 can each be or include a differentIC or can have any permutation of including a same IC and/or differentICs. For example, any of the fabric chips 104-108 can be or include aprocessing IC or memory. In some examples, the chip 108 is an ASIC. Anychip 102-108 may generically be referred to as an active chip.

FIG. 2 is a block diagram of a circuit schematic depicting ICs of a chipstack of the multi-chip device of FIG. 1 according to some examples. Inthe illustrated example, the multi-chip device is a multi-chipprogrammable device. The circuit schematic can be implemented in themulti-chip device of FIG. 1, e.g., regardless of the orientation of thefabric chips 104, 106.

In the illustrated example, the base chip 102 includes a base IC on thebase chip 102, which may be a SoC. The fabric chips 104, 106, 108include a respective programmable logic (PL) IC 224, 226, 228, which, insome examples, is a same IC and has a same hardware layout and topology.These ICs are provided as an example implementation. Other ICs (e.g.,with other hard IP blocks) can be implemented in the chips. The fabricchips 104, 106, 108 further include a respective Z-interface 234, 236,238.

The base IC on the base chip 102 includes a processing system 202,input/output circuits (IOs) 204, IP core circuits 206, a Network-on-Chip(NoC) 210, and a Z-interface 232. The processing system 202 may be orinclude any of a variety of different processor types and number ofprocessor cores. For example, the processing system 202 may beimplemented as an individual processor, e.g., a single core capable ofexecuting program instruction code. In another example, the processingsystem 202 may be implemented as a multi-core processor. The processingsystem 202 may be implemented using any of a variety of different typesof architectures. Example architectures that may be used to implementthe processing system 202 may include an ARM processor architecture, anx86 processor architecture, a graphics processing unit (GPU)architecture, a mobile processor architecture, a reduced instruction setcomputer (RISC) architecture (e.g., RISC-V), or other suitablearchitecture that is capable of executing computer-readable programinstruction code.

The input/output circuits 204 can include eXtreme PerformanceInput/Output (XPIO), multi-gigabit transceivers (MGTs), high bandwidthmemory (HBM) interfaces, Analog-to-Digital Converters (ADC),Digital-to-Analog Converters (DAC), or any other input/output blocks.The input/output circuits 204 can be configured to receive and/ortransmit signals from and/or to a circuit outside of the multi-chipdevice. The IP core circuits 206 can include memory controllers (such asdouble data rate (DDR) memory controllers, high bandwidth memory (HBM)memory controllers, or the like), peripheral component interconnectexpress (PCIe) interfaces, cache coherent interconnect for accelerators(CCIX) interfaces, Ethernet cores (such as a media address controller(MAC) or the like), forward error correction (FEC) blocks, and/or anyother hardened circuit. Any of the input/output circuits 204 and/or IPcore circuits 206 can be programmable.

The NoC 210 includes a programmable network 212 and a NoC peripheralinterconnect (NPI) 214. The programmable network 212 communicativelycouples subsystems and any other circuits of the base IC on the basechip 102 together. The programmable network 212 includes NoC packetswitches and interconnect lines connecting the NoC packet switches. EachNoC packet switch performs switching of NoC packets in the programmablenetwork 212. The programmable network 212 has interface circuits at theedges of the programmable network 212. The interface circuits includeNoC master units (NMUs) and NoC slave units (NSUs). Each NMU is aningress circuit that communicatively couples a master circuit to theprogrammable network 212, and each NSU is an egress circuit thatcommunicatively couples the programmable network 212 to a slave endpointcircuit. NMUs are communicatively coupled to NSUs via the NoC packetswitches and interconnect lines of the programmable network 212. The NoCpacket switches are connected to each other and to the NMUs and NSUsthrough the interconnect lines to implement a plurality of physicalchannels in the programmable network 212. The NoC packet switches, NMUs,and NSUs include register blocks that determine the operation of therespective NoC packet switch, NMU, or NSU.

The NPI 214 includes circuitry to write to register blocks thatdetermine the functionality of the NMUs, NSUs, and NoC packet switches.The NPI 214 includes a peripheral interconnect coupled to the registerblocks for programming thereof to set functionality. The register blocksin the NMUs, NSUs, and NoC packet switches of the programmable network212 support interrupts, quality of service (QoS), error handling andreporting, transaction control, power management, and address mappingcontrol. The NPI 214 can include an NPI root node residing on theprocessing system 202 (e.g., a platform management controller (PMC) ofthe processing system 202), interconnected NPI switches communicativelycoupled to the NPI root node, and protocol blocks connected to theinterconnected NPI switches and a corresponding register block. The NPI214 may be used to program any programmable circuit of the base IC onthe base chip 102. For example, the NPI 214 may be used to program anyinput/output circuit 204 and/or IP core circuit 206 that isprogrammable.

The Z-interface 232 can include active circuits, such as buffers todrive signals. The Z-interface 232 provides an interface, includingthrough metal lines/pads and vias in metallization layers, for theprocessing system 202, input/output circuits 204, IP core circuits 206,and programmable network 212 of the NoC 210 to chips overlying the basechip 102 and/or a substrate (e.g., package substrate) underlying thebase chip 102. Additionally, the Z-interface 232 can provide apass-through interface through the base chip 102.

The various subsystems and circuits of the base IC on the base chip 102can be communicatively coupled. As illustrated, the processing system202, input/output circuits 204, and IP core circuits 206 arecommunicatively coupled to the NoC 210 (e.g., to the programmablenetwork 212), and hence, are communicatively coupled to each other. Theprocessing system 202 is further communicatively coupled to the NPI 214for communicating configuration data to various programmable componentson the base chip 102. The processing system 202 is furthercommunicatively coupled to the programmable network 212 of the NoC 210for communicating configuration data to chips overlying the base chip102. The programmable network 212 of the NoC 210 is communicativelycoupled to the Z-interface 232 such that data, such as transactionaldata and configuration data, can be communicated through the Z-interface232 to another chip. Each of the processing system 202, input/outputcircuits 204, and IP core circuits 206 is communicatively coupled to theZ-interface 232 for communications with, e.g., programmable logic in thePL ICs 224, 226, 228 in overlying fabric chips 104, 106. Othercommunication mechanisms, such as direct connections, between thevarious subsystems and circuits may be implemented.

The PL IC 224-228 on each of the fabric chips 104-108 includes one ormore programmable logic region. The programmable logic region is logiccircuitry that may be programmed to perform specified functions. Theprogrammable logic region can include any number or arrangement ofprogrammable tiles. As an example, the programmable logic region may beimplemented as fabric of an FPGA. For example, the programmable logicregion can include any number of configurable logic blocks (CLBs),look-up tables (LUTs), digital signal processing blocks (DSPs), randomaccess memory blocks (BRAMs), etc. Each of the programmable tiles (e.g.,CLBs, LUTs, DSPs, BRAMs, etc.) can include one or more programmableinterconnect elements. The various respective types of programmabletiles can be arranged in rows and/or columns, and the associatedprogrammable interconnect elements can be electrically connected toneighboring programmable logic elements in a same column and row, forexample. The programmable interconnect element can form an interconnectnetwork of the programmable logic region. Any logic and connections canbe implemented by the programmable logic region by programming orconfiguring any of the programmable tiles of the programmable logicregion.

The Z-interface 234-238 on each of the fabric chips 104-108 can includeactive circuits, such as buffers to drive signals and/or selectioncircuits. The Z-interface 234-238 provides an interface, includingthrough metal lines and vias in metallization layers, for the respectivePL IC 224-228 to communicate with chips overlying and/or underlying therespective fabric chip 104-108. Additionally, the Z-interface 234-238can provide a pass-through interface through the respective fabric chip104-108. Configuration data for the PL ICs 224-228 can be transmittedthrough passive connections through Z-interfaces 234-238, for example.

Each PL IC 224-228 can also include a configuration interconnect thatincludes a configuration Frame (CFRAME) driver. The CFRAME driver may beor include control logic to communicate configuration data (such as abitstream) to configure programmable logic. Each programmable logicregion is configurable or programmable by configuration data receivedvia the Z-interface 232, a corresponding Z-interface 234-238 of therespective fabric chip 104-108, and any intervening Z-interface 234,236. For example, the processing system 202 (e.g., a PMC of theprocessing system 202) can transmit configuration data via theprogrammable network 212 of the NoC 210 and the Z-interface 232 to arespective PL IC 224-228. In some examples, a configuration interconnect(e.g., including a CFRAME driver) can direct the configuration data toappropriate programmable tiles and can control configuring suchprogrammable tiles.

Examples of clock tree routing are described below in the context of aprogrammable clock routing network of the chip stack. As notedpreviously, aspects of clock tree routing as described herein areapplicable to a chip stack that includes and/or consists of chips havingASICs and/or have clock trees that are hardwired and/ornon-programmable. In the examples below, the programmable clock routingnetwork includes multiple tiers of an in-chip programmable clock routingnetwork, where each of the fabric chips 104-108 includes a tier of anin-chip programmable clock routing network. Out-of-chip connections arebetween the tiers to electrically connect the tiers in the programmableclock routing network. As used for convenience herein, “in-chip”generally refers to, with reference to FIG. 1, directionality along anX-direction and/or Y-direction. Additionally, as used for convenienceherein, “out-of-chip” generally refers to, with reference to FIG. 1,directionality along a Z-direction.

FIG. 3 is a block diagram depicting a fabric chip 300 comprising a PL IC302 according to some examples. The fabric chip 300 can represent eachof the fabric chips 104-108. The PL IC 302 can represent each PL IC224-228. The PL IC 302 includes out-of-chip clock routing regions 304and clock regions 310-11 to 310-44 (collectively or individually, clockregion(s) 310). The out-of-chip clock routing regions 304 can representa portion of each of the Z-interfaces 234-238.

In the example of FIG. 3, PL IC 302 is formed of a two-dimensional arrayof clock regions 310. Each clock region 310 can correspond to a regionof logic circuitry that is programmable to perform specified functions(e.g., a programmable logic region) and can be programmed to provide aclock signal to that logic circuitry. FIG. 3 illustrates, forsimplicity, the clock regions 310 arranged in four aligned in-chipcolumns and four aligned in-chip rows, although other numbers of in-chipcolumns and/or in-chip rows may be implemented. The reference numeralsof the clock regions 310 in FIG. 3 indicate the positioning of eachclock region 310 by the reference number “310-[in-chip column][in-chiprow].”

Example arrangements of programmable logic elements, including CLBs 312,BRAMs 314 and DSPs 316, are illustrated in some of the clock regions310. The CLBs 312 can further include LUTs. In the illustratedarchitecture, the PL IC 302 includes in-chip columns of programmablelogic elements, where each in-chip column includes a single type ofprogrammable logic element (e.g., an in-chip column of CLBs 312, anin-chip column of BRAMs 314, etc.). As shown in FIG. 4, the programmablelogic elements can have one or more associated programmable interconnectelements 320. For example, in some architectures, the PL IC 302 includesan in-chip column of programmable interconnect elements 320 associatedwith and neighboring each in-chip column of programmable logic elements.In such examples, each programmable interconnect element 320 iselectrically connected to an associated programmable logic element in aneighboring in-chip column by interconnections 324 and is electricallyconnected to neighboring programmable interconnect elements within thesame in-chip column by interconnections 326 and is electricallyconnected to the neighboring in-chip columns by interconnections 328.The interconnected programmable interconnect elements 320 can form adata routing network within the PL IC 302.

The out-of-chip clock routing regions 304 are each disposed extending inan in-chip column direction between a pair of in-chip columns of theclock regions 310. One out-of-chip clock routing region 304 is disposedbetween an in-chip column of clock regions 310-1 x and an in-chip columnof clock regions 310-2 x. Another out-of-chip clock routing region 304is disposed between an in-chip column of clock regions 310-3 x and anin-chip column of clock regions 310-4 x. As described in detailsubsequently, each of the out-of-chip clock routing regions 304 includesconnections (e.g., a metal stack including metal lines, metal vias, andTSV(s)) that are configured to route clock signals between chips of thechip stack. Further, each of the out-of-chip clock routing regions 304includes circuitry configured to route a clock signal from suchconnections in an in-chip direction within the fabric chip 300.

The numbers of clock regions 310 and out-of-chip clock routing regions304 are shown merely as an example. Devices implementing conceptsdescribed herein can implement any number of clock regions (and further,in any configuration) in the PL IC and any number of out-of-chip clockrouting regions in the PL IC.

FIG. 5 illustrates aspects of a tier of an in-chip programmable clockrouting network in the PL IC 302 according to some examples. The tierincludes in-chip horizontal transmission tracks 502-1, 502-2, 502-3,502-4 (collectively or individually, in-chip horizontal transmissiontrack(s) 502) and in-chip vertical transmission tracks 504-1, 504-2,504-3, 504-4 (collectively or individually, in-chip verticaltransmission track(s) 504). The tier also includes in-chip horizontaldistribution tracks 506-1, 506-2, 506-3, 506-4 (collectively orindividually, in-chip horizontal distribution track(s) 506) and in-chipvertical distribution tracks 508-1, 508-2, 508-3, 508-4 (collectively orindividually, in-chip vertical distribution track(s) 508). The in-chiptransmission tracks 502, 504 are configured to route a clock signal forlong reaches across the respective fabric chip 104-108 (e.g., acrossmany clock regions 310). The in-chip distribution tracks 506, 508 areconfigured to route a clock signal for moderate reaches across therespective fabric chip 104-108 (e.g., across one or a few clock regions310). Each of the in-chip horizontal transmission tracks 502, in-chipvertical transmission tracks 504, in-chip horizontal distribution tracks506, and in-chip vertical distribution tracks 508 can be or includesixteen individual tracks, or another number of tracks.

Each of the in-chip horizontal transmission tracks 502 extends in-chiphorizontally across the PL IC 302 at centers of respective in-chip rowsof clock regions 310. In-chip horizontal transmission tracks 502-1extend across the PL IC 302 at centers of clock regions 310-11, 310-21,310-31, 310-41. In-chip horizontal transmission tracks 502-2 extendacross the PL IC 302 at centers of clock regions 310-12, 310-22, 310-32,310-42. In-chip horizontal transmission tracks 502-3 extend across thePL IC 302 at centers of clock regions 310-13, 310-23, 310-33, 310-43.In-chip horizontal transmission tracks 502-4 extend across the PL IC 302at centers of clock regions 310-14, 310-24, 310-34, 310-44.

Each of the in-chip vertical transmission tracks 504 extends in-chipvertically across the PL IC 302 at centers of respective in-chip columnsof clock regions 310. In-chip vertical transmission tracks 504-1 extendacross the PL IC 302 at centers of clock regions 310-11, 310-12, 310-13,310-14. In-chip vertical transmission tracks 504-2 extend across the PLIC 302 at centers of clock regions 310-21, 310-22, 310-23, 310-24.In-chip vertical transmission tracks 504-3 extend across the PL IC 302at centers of clock regions 310-31, 310-32, 310-33, 310-34. In-chipvertical transmission tracks 504-4 extend across the PL IC 302 atcenters of clock regions 310-41, 310-42, 310-43, 310-44.

Each of the in-chip horizontal distribution tracks 506 extends in-chiphorizontally across the PL IC 302 at centers of respective in-chip rowsof clock regions 310. In-chip horizontal distribution tracks 506-1extend across the PL IC 302 at centers of clock regions 310-11, 310-21,310-31, 310-41. In-chip horizontal distribution tracks 506-2 extendacross the PL IC 302 at centers of clock regions 310-12, 310-22, 310-32,310-42. In-chip horizontal distribution tracks 506-3 extend across thePL IC 302 at centers of clock regions 310-13, 310-23, 310-33, 310-43.In-chip horizontal distribution tracks 506-4 extend across the PL IC 302at centers of clock regions 310-14, 310-24, 310-34, 310-44.

Each of the in-chip vertical distribution tracks 508 extends in-chipvertically across the PL IC 302 at centers of respective in-chip columnsof clock regions 310. In-chip vertical distribution tracks 508-1 extendacross the PL IC 302 at centers of clock regions 310-11, 310-12, 310-13,310-14. In-chip vertical distribution tracks 508-2 extend across the PLIC 302 at centers of clock regions 310-21, 310-22, 310-23, 310-24.In-chip vertical distribution tracks 508-3 extend across the PL IC 302at centers of clock regions 310-31, 310-32, 310-33, 310-34. In-chipvertical distribution tracks 508-4 extend across the PL IC 302 atcenters of clock regions 310-41, 310-42, 310-43, 310-44.

Additionally, each of the in-chip horizontal transmission tracks 502 andeach of the in-chip horizontal distribution tracks 506 traverses theout-of-chip clock routing regions 304. Each of the in-chip horizontaltransmission tracks 502 can also be programmably electrically connectedto out-of-chip routing (e.g., vertical connections) to receive a clocksignal from the base chip 102.

FIG. 6 is a schematic of out-of-chip routing to route clock signalsout-of-chip according to some examples. FIG. 6 shows the base chip 102and the fabric chips 104-108. The base chip 102 includes clock sourcecircuits 602-1 to 602-n. Portions of respective out-of-chip clockrouting regions 304 in the fabric chips 104-108 are also shown.

Metal stacks 604-1 to 604-n extend out-of-chip across the chip stackthrough the respective out-of-chip clock routing regions 304 in the PLICs 224-228 in the fabric chips 104-108. In the orientation illustratedin FIG. 1, each metal stack 604 includes, although not specificallyshown in FIG. 6, metal line(s) and via(s) in the front side dielectriclayer(s) 122, a front side bond pad 152, a front side bond pad 154,metal lines and vias in the front side dielectric layer(s) 124, abackside TSV 164, metal lines and vias in the backside dielectriclayer(s) 134, a backside bond pad 174, a front side bond pad 156, metallines and vias in the front side dielectric layer(s) 126, a backside TSV166, metal lines and vias in the backside dielectric layer(s) 136, abackside bond pad 176, a front side bond pad 158, and metal lines andvias in the front side dielectric layer(s) 128. Other orientations canhave different components and/or order of components. The number ofcomponents can further be varied based on the number of chips in thechip stack. The metal lines, vias, TSVs, and bond pads in a given metalstack 604 are generally aligned in an out-of-chip direction.

Each metal stack 604 is electrically connected to a corresponding clocksource circuit 602. The corresponding metal stack 604 and clock sourcecircuit 602 may or may not be aligned in the out-of-chip direction. Eachclock source circuit 602 can include, for example, a phase-locked loop(PLL) circuit, a driver circuit, or any other circuit to generate and/ordrive a clock signal through the corresponding metal stack 604.

Each fabric chip 104-108 includes an individual in-chip transmissiontrack 610 (of the in-chip horizontal transmission tracks 502 or in-chipvertical transmission tracks 504) in the respective fabric chip. Eachindividual in-chip transmission track 610 within a respective fabricchip 104-108 is configured to be programmably electrically connected toa respective metal stack 604-1 to 604-n. Each individual in-chiptransmission track 610 includes a first individual in-chip transmissiontrack segment 610-L and a second individual in-chip transmission tracksegment 610-R, where, solely for ease of reference, an “L” refers to aleft segment in, e.g., a clock region 310 to the left of the out-of-chipclock routing region 304, and an “R” refers to a right segment in, e.g.,a clock region 310 to the right of the out-of-chip clock routing region304. Reference numbers of components illustrated in FIG. 6 are appendedwith the notation “-i-j”, where i indicates a relation with acorresponding clock source circuit 602-i and/or a corresponding metalstack 604-i, and j indicates a corresponding fabric chip 104, 106, 108.The following description is generic to multiple components illustratedin FIG. 6 (e.g., without reference to any appended notation “-i-j”), anda person having ordinary skill in the art will readily understand theapplicability of such description to each corresponding component.

Each individual in-chip transmission track 610 includes a bidirectionalbridge 612. A buffer 614 is electrically connected between the metalstack 604 and the bidirectional bridge 612. The bidirectional bridge 612includes buffers 622, 624, 626, 628. The bidirectional bridge 612programmably electrically connects together and/or decouples the firstindividual in-chip transmission track segment 610-L and the secondindividual in-chip transmission track segment 610-R. The buffer 614programmably electrically connects the bidirectional bridge 612 to themetal stack 604.

An input node of the buffer 614 is electrically connected to the metalstack 604, and an output node of the buffer 614 is electricallyconnected to a bridge node of the bidirectional bridge 612. The bridgenode of the bidirectional bridge 612 is electrically connected to anoutput node of the buffer 622, an input node of the buffer 624, an inputnode of the buffer 626, and an output node of the buffer 628. An inputnode of the buffer 622 and an output node of the buffer 626 areelectrically connected to the first individual in-chip transmissiontrack segment 610-L. An output node of the buffer 624 and an input nodeof the buffer 628 are electrically connected to the second individualin-chip transmission track segment 610-R.

Each buffer 614, 622, 624, 626, 628 may be or include a tri-state bufferRespective control signals of the buffers 614, 622, 624, 626, 628 can bestored in configuration memory (e.g., configuration random access memory(CRAM)) in the PL IC 302, which can be programmed during programming thePL IC 302. By programming various ones of the buffers 614, 622, 624,626, 628, clock signals can be routed and distributed from a clocksource to various loads in the PL IC 302 and to various loads in otherchips.

As some examples, each of the buffers 614, 622, 624, 626, 628 can beprogrammed in a high impedance output state or a pass-through state. Ina high impedance output state, the output node of the respective bufferis at a high impedance, which effectively decouples the input node fromthe output node of the buffer. In a pass-through state, a signalreceived an input node of the buffer is propagated through to the outputnode of the buffer. The buffer 614 can be programmed in a high impedanceoutput state to decouple the metal stack 604 from the bidirectionalbridge 612. With the metal stack 604 decoupled from the bidirectionalbridge 612, a clock signal can be propagated from the first individualin-chip transmission track segment 610-L to the second individualin-chip transmission track segment 610-R by programming the buffers 622,624 to be in a pass-through state while the buffers 626, 628 areprogrammed in a high impedance output state, and a clock signal can bepropagated from the second individual in-chip transmission track segment610-R to the first individual in-chip transmission track segment 610-Lby programming the buffers 626, 628 to be in a pass-through state whilethe buffers 622, 624 are programmed in a high impedance output state.The first individual in-chip transmission track segment 610-L to thesecond individual in-chip transmission track segment 610-R can bedecoupled from each other by programming the buffers 622-628 to be in ahigh impedance output state. A clock signal can be routed from the metalstack 604 to the first individual in-chip transmission track segment610-L by programming the buffers 614, 626 to be in a pass-through stateand the buffer 622 to be in a high impedance output state, and from themetal stack 604 to the second individual in-chip transmission tracksegment 610-R by programming the buffers 614, 624 to be in apass-through state and the buffer 628 to be in a high impedance outputstate. Other combinations of programming the buffers can be implementedto route a clock signal.

FIG. 7 illustrates aspects of a tier of an in-chip programmable clockrouting network in a clock region 310 according to some examples.Out-of-chip routing bridges 702 are at a boundary of the clock region310 and electrically connect the in-chip horizontal transmission tracks502 across neighboring clock regions 310. Out-of-chip routing bridges702 are at a boundary of the clock region 310 and electrically connectthe in-chip vertical transmission tracks 504 across neighboring clockregions 310. Out-of-chip routing bridges 702 are at a boundary of theclock region 310 and electrically connect the in-chip horizontaldistribution tracks 506 across neighboring clock regions 310.Out-of-chip routing bridges 702 are at a boundary of the clock region310 and electrically connect the in-chip vertical distribution tracks508 across neighboring clock regions 310. The out-of-chip routingbridges 702 can programmably electrically connect or decouple respectivesegments of in-chip transmission tracks 502, 504 and in-chipdistribution tracks 506, 508 within the clock region 310 of therespective chip to or from segments of in-chip transmission tracks 502,504 and in-chip distribution tracks 506, 508 within another clock region310 of the respective chip, an overlying chip, and/or an underlyingchip. In some examples, any of the out-of-chip routing bridges 702 inFIG. 7 can be replaced with a bidirectional buffer that can electricallyconnect or decouple respective segments of in-chip transmission tracks502, 504 and in-chip distribution tracks 506, 508 within the clockregion 310 of the respective chip to or from segments of in-chiptransmission tracks 502, 504 and in-chip distribution tracks 506, 508within another clock region 310 of the respective chip. The presence ofthe out-of-chip routing bridges 702 can be optional based on anarchitecture of the chip stack, such as if defect tolerances isimplemented in the chip stack to bypass a defect and, if implemented,how the defect tolerance is implemented.

An example out-of-chip routing bridge 702 is described subsequently. Insome examples, such as where the boundary adjoins an out-of-chip clockrouting region 304, the out-of-chip routing of FIG. 6 may be implementedin the place of or in addition to the out-of-chip routing bridge 702.Further, the out-of-chip routing bridges 702 can be placed differentlyin other examples. In some examples, an out-of-chip routing bridge 702may be placed along, e.g., a same in-chip horizontal transmission track502 at a border of a clock region 310 with some number of clock regions310 being disposed between neighboring out-of-chip routing bridges 702.When an out-of-chip routing bridge 702 is not placed along an in-chiptransmission track 502, 504 or in-chip distribution track 506, 508 at aborder of a clock region 310, a bidirectional buffer may be placed atthat border of that clock region 310 for the in-chip transmission track502, 504 or in-chip distribution track 506, 508.

A bidirectional buffer 710 is electrically connected between the in-chiphorizontal transmission track 502 and the in-chip vertical transmissiontrack 504. A unidirectional interconnect buffer 714 has an input nodeelectrically connected to the in-chip vertical transmission track 504and an output node electrically connected to the in-chip verticaldistribution track 508. A unidirectional interconnect buffer 716 has aninput node electrically connected to the in-chip vertical distributiontrack 508 and an output node electrically connected to the in-chiphorizontal distribution track 506.

Input nodes of first leaf clock buffers 720 are electrically connectedto the in-chip horizontal distribution track 506, and respective outputnodes of the first leaf clock buffers 720 are electrically connected torespective out-of-chip leaf-level connection nodes 722. Each out-of-chipleaf-level connection node 722 forms an electrical connection at theleaf level between leaf nodes that generally align in the out-of-chipdirection in other chips. An example of an out-of-chip leaf-levelconnection node 722 is described subsequently. The respectiveout-of-chip leaf-level connection nodes 722 are electrically connectedto respective input nodes of second leaf clock buffers 724, andrespective output nodes of the second leaf clock buffers 724 areelectrically connected to leaf clock tracks 726 that extend alongrespective in-chip columns in the clock region 310 to programmable logicelements (e.g., loads) within the clock region 310. The leaf clocktracks 726 are respective load nodes (e.g., to which the circuitelements that consume the respective clock signals are, e.g., directlyelectrically connected).

Each out-of-chip routing bridge 702 may include one or more tri-statebuffers and one or more multiplexers, as described below. Each buffer710, 714, 716, 720, 724 may be or include a tri-state buffer. In someexamples, any and/or each leaf clock buffer 720, 724 can be any otherselective transmitting circuit, such as a multiplexer. Respectivecontrol signals of the out-of-chip routing bridges 702 and buffers 710,714, 716, 720, 724 (or other selective transmitting circuit) can bestored in configuration memory (e.g., CRAM) in the PL IC 302, which canbe programmed during programming the PL IC 302. By programming variousones of the out-of-chip routing bridges 702 and buffers 710, 714, 716,720, 724, clock signals can be routed and distributed from a clocksource to various loads in the PL IC 302 and to various loads in otherchips. A person having ordinary skill in the art will readily understandhow the various buffers can be programmed to route a clock signal,particularly in view of examples provided above with respect to FIG. 6.

FIG. 8 shows a schematic of a leaf-level connection bridge electricallyconnected to the programmable clock routing network in the chip stackaccording to some examples. A portion of a respective clock region 310is illustrated in each fabric chip 104-108. FIG. 8 follows thenomenclature from above where a reference number is appended with a“−4”, “−6”, or “−8” corresponding to the fabric chip 104, 106, 108,respectively. Each portion of a clock region 310 is shown with anindividual in-chip horizontal distribution track segment 802 of thein-chip horizontal distribution tracks 506 of that clock region 310,which forms part of the programmable clock routing network. Likedescribed with respect to FIG. 7, an input node of a first leaf clockbuffer 720 is electrically connected to the individual in-chiphorizontal distribution track segment 802, and an output node of thefirst leaf clock buffer 720 is electrically connected to an out-of-chipleaf-level connection node 722. The out-of-chip leaf-level connectionnode 722 is electrically connected to an input node of a second leafclock buffer 724, and an output node of the second leaf clock buffer 724is electrically connected to a leaf clock track 726. As stated above,any and/or each leaf clock buffer 720, 724 can be any other selectivetransmitting circuit, such as a multiplexer.

In the context of the example orientation of FIG. 1, the out-of-chipleaf-level connection node 722 includes, although not specifically shownin FIG. 8, metal lines and vias in the front side dielectric layer(s)124, a backside TSV 164, metal lines and vias in the backside dielectriclayer(s) 134, a backside bond pad 174, a front side bond pad 156, metallines and vias in the front side dielectric layer(s) 126, a backside TSV166, metal lines and vias in the backside dielectric layer(s) 136, abackside bond pad 176, a front side bond pad 158, and metal lines andvias in the front side dielectric layer(s) 128. Other orientations canhave different components and/or order of components. The number ofcomponents can further be varied based on the number of chips in thechip stack. The metal lines, vias, TSVs, and bond pads in a givenout-of-chip leaf-level connection node 722 are generally aligned in anout-of-chip direction.

The out-of-chip leaf-level connection node 722 forms a common bridgenode between (i) output nodes of the first leaf clock buffers 720-4,720-6, 720-8 and (ii) input nodes of the second leaf clock buffers724-4, 724-6, 724-8. When a clock signal is routed to a given individualin-chip horizontal distribution track segment 802, the correspondingfirst leaf clock buffer 720 can be programmed to be in a state wherethat first leaf clock buffer 720 passes the clock signal to theout-of-chip leaf-level connection node 722. The other first leaf clockbuffers 720 having output nodes electrically connected to theout-of-chip leaf-level connection node 722 can be programmed to be in ahigh impedance output state to decouple the corresponding individualin-chip horizontal distribution track segments 802 electricallyconnected to the input nodes of those first leaf clock buffers 720 fromthe out-of-chip leaf-level connection node 722. The second leaf clockbuffers 724 can then be programmed to pass the clock signal from theout-of-chip leaf-level connection node 722 to corresponding leaf clocktracks 726 or to have a high impedance output state to decouple thecorresponding leaf clock tracks 726 from the out-of-chip leaf-levelconnection node 722.

In the illustrated example, the out-of-chip leaf-level connection node722 forms a common node. In other examples, an out-of-chip leaf-levelconnection bridge can include circuitry to selectively electricallycouple and decouple the output nodes of the first leaf clock buffers 720to various ones of the input nodes of the second leaf clock buffers 724.For example, a bidirectional buffer can be electrically connectedbetween (i) the node formed by the electrical connection between theoutput node of the first leaf clock buffer 720-4 and the input node ofthe second leaf clock buffer 724-4, and (ii) the node formed by theelectrical connection between the output node of the first leaf clockbuffer 720-6 and the input node of the second leaf clock buffer 724-6; abidirectional buffer can be electrically connected between (i) the nodeformed by the electrical connection between the output node of the firstleaf clock buffer 720-6 and the input node of the second leaf clockbuffer 724-6, and (ii) the node formed by the electrical connectionbetween the output node of the first leaf clock buffer 720-8 and theinput node of the second leaf clock buffer 724-8; and a bidirectionalbuffer can be electrically connected between (i) the node formed by theelectrical connection between the output node of the first leaf clockbuffer 720-4 and the input node of the second leaf clock buffer 724-4,and (ii) the node formed by the electrical connection between the outputnode of the first leaf clock buffer 720-8 and the input node of thesecond leaf clock buffer 724-8. In such examples, the bidirectionalbuffer(s) can be programmable, such that respective control signals ofthe bidirectional buffer(s) can be stored in configuration memory (e.g.,CRAM) in the PL IC 302, which can be programmed during programming thePL IC 302. Other circuitry can be implemented.

FIG. 9 illustrates, conceptually, clock trees 902, 904 in a chip stackaccording to some examples. The clock trees 902, 904 are described inthe context of the PL ICs described above; however, concepts describedwith respect to the clock trees 902, 904 are applicable to, e.g.,non-programmable ASICs and/or a combination of programmable andnon-programmable ASICs, where the clock trees 902, 904 may be routesthat are hardwired and non-programmable in the chip stack or where theclock trees 902, 904 may in part be programmable and in other parts behardwired and non-programmable in the chip stack. Components that areprogrammed to implement the aspects described herein can be hardwiredand non-programmable to likewise implement those aspects.

Generally, in-chip routing of a clock tree to leaf level(s) that operateon a same clock signal provided by the clock tree is contained (e.g.,wholly contained) within one logical chip. In some instances, onelogical chip is one physical chip. In some instances, e.g., where aportion of a physical chip is defective, one logical chip can includeportions of two or more physical chips. For example, in-chip routing ofa clock tree to leaf level(s) is contained within one logical chip when,from a branching point (if any) of the clock tree, all of the branchesof the clock tree have corresponding in-chip routing within a samephysical chip to out-of-chip routing (if any) that are at respectivegenerally same in-chip locations within that physical chip, and fromthat out-of-chip routing, corresponding in-chip routing of all of thebranches is within another same physical chip, which out-of-chip routingcan occur any number of times at respective in-chip locations withsubsequent corresponding in-chip routing of all of the branches beingwithin a same physical chip until the leaf level(s) are reached.

The base chip 102 includes clock source circuits 912, 914. The clocksource circuit 912 is configured to generate a clock signal to be routedby the clock tree 902, and the clock source circuit 914 is configured togenerate a clock signal to be routed by the clock tree 904. From theclock source circuit 912, the clock tree 902 includes out-of-chiprouting from the base chip 102 to the fabric chip 104. In the context ofFIG. 6, this can be implemented by the clock source circuit 912 havingan output node electrically connected to a metal stack 604. A buffer614-4 on the fabric chip 104 that has an input node electricallyconnected to the metal stack 604 can be programmed to a pass-throughstate, while other buffers 614 that have respective input nodeselectrically connected to the metal stack 604 are programmed to a highimpedance output state.

The clock tree 902 is then in-chip routed wholly within the fabric chip104. The clock tree 902 includes multiple (e.g., three) branches in thein-chip routing. In the context of FIGS. 5-7, the in-chip routing of theclock tree 902 can be implemented by in-chip horizontal transmissiontracks 502 (e.g., including an appropriate individual in-chiptransmission track 610-4) and in-chip vertical transmission tracks 504,e.g., for long reaches across the fabric chip 104 (e.g., across manyclock regions 310). Turns, intersections, branching, etc., of or betweenthe in-chip horizontal transmission tracks 502 and in-chip verticaltransmission tracks 504 can be implemented using appropriatebidirectional buffers 710 in respective clock regions 310. The in-chiprouting can further be implemented by in-chip horizontal distributiontracks 506 and in-chip vertical distribution tracks 508, e.g., formoderate reaches across the fabric chip 104 (e.g., across one or a fewclock regions 310). The in-chip horizontal distribution tracks 506 andin-chip vertical distribution tracks 508 can be electrically connectedto appropriate ones of the in-chip horizontal transmission tracks 502and in-chip vertical transmission tracks 504, and various turns andintersections can be implemented, by buffers 714, 716 at appropriateclock regions 310. At a respective clock region 310 that includes theleaf nodes of the fabric chip 104 that operate using or consume theclock signal of the clock tree 902, the clock tree 902 includes anappropriate in-chip horizontal distribution track 506 (e.g., individualin-chip horizontal distribution track segment 802).

After the in-chip routing, the clock tree 902 reaches the leaf level.The leaf level can include tracks (e.g., short reach tracks) in a clockregion 310 that are directly electrically connected to respective one ormore leaf nodes in the clock region 310 that consume or operate on theclock signal provided via the clock tree 902. Out-of-chip leaf-levelconnection bridges 922 are connected to the clock tree 902 at the leaflevel. In the context of FIGS. 7 and 8, the individual in-chiphorizontal distribution track segment 802-4 within a respective clockregion 310 on the fabric chip 104 is the concluding branch of thein-chip routing of the clock tree 902. For each out-of-chip leaf-levelconnection bridge 922 (e.g., as shown in FIG. 8), the correspondingfirst leaf clock buffer 720-4 in the fabric chip 104 having an inputnode electrically connected to the individual in-chip horizontaldistribution track segment 802-4 is programmed to be in a pass-throughstate, and the other buffers 720 having respective output nodeselectrically connected to the out-of-chip leaf-level connection node 722are programmed to be in a high impedance output state to decouple theout-of-chip leaf-level connection node 722 from individual in-chiphorizontal distribution track segments 802 in other chips. Appropriateones of the buffers 724 in any chip 102-108 are then programmed in apass-through state or high impedance output state to electricallyconnect or decouple the out-of-chip leaf-level connection node 722 tocorresponding leaf clock tracks 726. The leaf clock tracks 726 aredirectly electrically connected to the leaf nodes, (e.g., withoutfurther branching of the tracks).

The clock tree 904 is like the clock tree 902 except the in-chip routingis within the fabric chip 106. From the clock source circuit 914, theclock tree 904 includes out-of-chip routing from the base chip 102 tothe fabric chip 106. The clock tree 904 is then in-chip routed whollywithin the fabric chip 106 and includes multiple branches in the in-chiprouting. After the in-chip routing, the clock tree 904 reaches the leaflevel. Out-of-chip leaf-level connection bridges 924 are connected tothe clock tree 904 at the leaf level.

According to some examples, having in-chip routing contained within onelogical chip can reduce skew of a clock signal received at leaf nodes ondifferent chips. In semiconductor processing, process variation canresult in a variation within a wafer (e.g., intra-wafer variation) and avariation from wafer-to-wafer (e.g., inter-wafer variation). Whileinter-wafer variation may occur between wafers of a same lot,inter-wafer variation may be greater between wafers of different lots.As highlighted below, the chips 102-108 can be fabricated on differentwafers, which can result in inter-wafer variation between the chips102-108. If a clock tree includes in-chip routing in parallel indifferent chips, the inter-wafer variation can cause skew between theclock signal received at a leaf node on one chip and the clock signalreceived at a leaf node on a different chip. According to some examples,with in-chip routing being within one logical chip, the clock signalreceived at leaf nodes on different chips can be propagated largely on asame path such that skew of the clock signal relative to what wasgenerated by the clock source circuit is a common mode skew to thoseleaf nodes, and any skew between the clock signal at different leafnodes can result from relatively short reaches by out-of-chip leaf-levelconnection bridges and leaf clock tracks. These relatively short reachescan reduce the skew between the clock signal received at the differentleaf nodes since the difference in paths, and resulting variation (e.g.,due to inter-wafer variation), to the different leaf nodes can berelatively small. Even when a clock tree has multiple branches in thein-chip routing within a logical chip, the skew between clock signalsreceived from the different branches can be relatively small due tointra-wafer variation within that logical chip generally beingrelatively small (e.g., in relation to inter-wafer variation).Implementing such in-chip routing for a clock tree can reduce holdviolations, and can increase performance by increasing timing margins.

FIG. 10 is a schematic of out-of-chip routing bridges 1002-4, 1002-6,1002-8 in a chip stack according to some examples. FIG. 10 follows thenomenclature from above where a reference number is appended with a“−4”, “−6”, or “−8” corresponding to the fabric chip 104, 106, 108,respectively. Each out-of-chip routing bridge 1002 is an individualinstance of an out-of-chip routing bridge 702 in FIG. 7 at a respectiveboundary between clock regions 310 in a respective chip. Eachout-of-chip routing bridge 1002 is electrically connected between anindividual in-chip horizontal transmission track segment 1004-L ofin-chip horizontal transmission tracks 502, in-chip verticaltransmission tracks 504, in-chip horizontal distribution tracks 506, orin-chip vertical distribution tracks 508 in, e.g., a left clock region310 and an individual in-chip horizontal transmission track segment1004-R of in-chip horizontal transmission tracks 502, in-chip verticaltransmission tracks 504, in-chip horizontal distribution tracks 506, orin-chip vertical distribution tracks 508 in, e.g., a right clock region310. Each out-of-chip routing bridge 1002 includes multiplexers 1010,1020 and buffers 1012, 1022.

A first input node of the multiplexer 1010 is electrically connected toa corresponding individual in-chip horizontal transmission track segment1004-L within the respective chip. A second input node of themultiplexer 1010 is electrically connected to an individual in-chiphorizontal transmission track segment 1004-L in a chip underlying therespective chip (if any). A third input node of the multiplexer 1010 iselectrically connected to an individual in-chip horizontal transmissiontrack segment 1004-L in a chip overlying the respective chip (if any).An output node of the multiplexer 1010 is electrically connected to aninput node of the buffer 1012. An output node of the buffer 1012 iselectrically connected to a corresponding individual in-chip horizontaltransmission track segment 1004-R within the respective chip.

A first input node of the multiplexer 1020 is electrically connected toa corresponding individual in-chip horizontal transmission track segment1004-R within the respective chip. A second input node of themultiplexer 1020 is electrically connected to an individual in-chiphorizontal transmission track segment 1004-R in a chip underlying therespective chip (if any). A third input node of the multiplexer 1020 iselectrically connected to an individual in-chip horizontal transmissiontrack segment 1004-R in a chip overlying the respective chip (if any).An output node of the multiplexer 1020 is electrically connected to aninput node of the buffer 1022. An output node of the buffer 1022 iselectrically connected to a corresponding individual in-chip horizontaltransmission track segment 1004-L within the respective chip.

In the context of the example orientation of FIG. 1, a connectionbetween an input node of a multiplexer 1010, 1020 of a respective chipand an individual in-chip horizontal transmission track segment 1004-L,1004-R in a chip overlying the respective chip can include metal linesand vias in the front side dielectric layer(s) 124, 126 of therespective chip, a backside TSV 164, 166 of the respective chip, metallines and vias in the backside dielectric layer(s) 134, 136 of therespective chip, a backside bond pad 174, 176 of the respective chip, afront side bond pad 156, 158 of the overlying chip, and metal lines andvias in the front side dielectric layer(s) 126, 128 of the overlyingchip. In the context of the example orientation of FIG. 1, a connectionbetween an input node of a multiplexer 1010, 1020 of a respective chipand an individual in-chip horizontal transmission track segment 1004-L,1004-R in a chip underlying the respective chip can include metal linesand vias in the front side dielectric layer(s) 126, 128 of therespective chip, a front side bond pad 156, 158 of the respective chip,a backside bond pad 174, 176 of the underlying chip, metal lines andvias in the backside dielectric layer(s) 134, 136 of the underlyingchip, a backside TSV 164, 166 of the respective chip, and metal linesand vias in the front side dielectric layer(s) 124, 126 of theunderlying chip. Other orientations can have different components and/ororder of components. The number of components can further be variedbased on the number of chips in the chip stack.

The out-of-chip routing bridges 1002 permit bypassing defective clockregions by routing a clock signal to an underlying or overlying chip.Assuming no defects, clock signals can be routed based on aconfiguration generated from a user design. Under such a scenario, eachmultiplexer 1010 can be programmed to output a signal from the inputnode electrically connected to the individual in-chip horizontaltransmission track segment 1004-L disposed on the same chip of therespective multiplexer 1010, and each multiplexer 1020 can be programmedto output a signal from the input node electrically connected to theindividual in-chip horizontal transmission track segment 1004-R disposedon the same chip of the respective multiplexer 1020. The buffers 1012,1022 can be programmed based on the directionality of the signal to berouted according to the user design. If a clock signal is to be routedfrom the individual in-chip horizontal transmission track segment 1004-Lto the individual in-chip horizontal transmission track segment 1004-R(e.g., from left to right in the illustration) in the same chip, thebuffer 1012 can be programmed in a pass-through state to pass the clocksignal, while the buffer 1022 can be programmed to have a high impedanceoutput state. Similarly, if a clock signal is to be routed from theindividual in-chip horizontal transmission track segment 1004-R to theindividual in-chip horizontal transmission track segment 1004-L (e.g.,from right to left in the illustration) in the same chip, the buffer1022 can be programmed in a pass-through state to pass the clock signal,while the buffer 1012 can be programmed to have a high impedance outputstate.

When a defect is present, the defect can be bypassed by programmingvarious ones of the multiplexers 1010, 1020 and buffers 1012, 1022. Forexample, assume a clock signal is routed on individual in-chiphorizontal transmission track segment 1004-L-6 (e.g., from left to rightin the illustration) in the fabric chip 106, and that individual in-chiphorizontal transmission track segment 1004-R-6 is defective (e.g., inthe metal line(s) of the individual in-chip horizontal transmissiontrack segment 1004-R-6 or some component electrically connected to themetal line(s) of the individual in-chip horizontal transmission tracksegment 1004-R-6). Both of the buffers 1012-6, 1022-6 are programmed tobe in high impedance output states. The buffer 1012-6 is programmed tobe in the high impedance output state due to the defect of theindividual in-chip horizontal transmission track segment 1004-R-6. Thebuffer 1022-6 is programmed to be in the high impedance output state dueto a user design routing the clock signal on the individual in-chiphorizontal transmission track segment 1004-L-6, e.g., from left toright. With the buffers 1012-6, 1022-6 programmed to be in highimpedance output states, the multiplexers 1010-6, 1020-6 can beprogrammed in any state (e.g., “do not care” state). The multiplexer1010-8 can be programmed to output the clock signal from the input nodethat is electrically connected to the individual in-chip horizontaltransmission track segment 1004-L-6, and the buffer 1012-8 can beprogrammed in a pass-through state to output the clock signal that isoutput from the multiplexer 1010-8 to the individual in-chip horizontaltransmission track segment 1004-R-8. The clock signal can then be routedalong the individual in-chip horizontal transmission track segment1004-R-8 in the fabric chip 108. A number of other combinations can beimplemented for routing clock signals as a person having ordinary skillin the art will readily understand upon viewing FIG. 10.

Each multiplexer 1010, 1020 can have control signals for controllingwhich input node is selected for outputting a signal from the selectedinput node, and the control signals can be stored in memory. In someexamples, the memory for the control signals of the multiplexers 1010,1020 is non-volatile, one-time programmable memory, such as electricfuses (eFuses). Programming the memory for the multiplexers 1010, 1020can be performed after fabrication of the chip stack and testing of thestacked chips. The testing can identify defects in the chips of the chipstack. Assuming sufficient resources of the chip stack are not defectivesuch that the chip stack can be operational, the memory can beprogrammed to provide routing between chips to bypass defects.

Each buffer 1012, 1022 may be or include a tri-state buffer. In someexamples, any and/or each buffer 1012, 1022 can be any other selectivetransmitting circuit, such as a multiplexer. A control signal of therespective buffer 1012, 1022 can result from logic (e.g., combinationallogic, such as an AND gate, NOR gate, or other logic) that hasrespective input nodes electrically connected to, e.g., two bits memory.One bit of memory can be non-volatile, one-time programmable memory,such as eFuses, that can be programmed as a result of testing. Forexample, if the individual in-chip horizontal transmission track segment1004 that is electrically connected to the output node of the respectivebuffer 1012, 1022 is defective, the one-bit of (e.g., non-volatile,one-time programmable) memory can be programmed such that the respectivebuffer 1012, 1022 is in a high impedance output state. Otherwise, theone-bit of memory can be programmed such that another one-bit of memory,such as configuration memory, that is electrically connected to anotherinput node of the logic controls the state of the respective buffer1012, 1022. The other one-bit of memory can be programmed such that therespective buffer 1012, 1022 is responsively in a pass-through state ora high impedance output state based on a user design. This other one-bitof memory for the respective buffer 1012, 1022 can be programmed duringprogramming the PL IC 302. Table 1 is the logic table for the state ofthe buffer 1012 (and correspondingly, buffer 1022 in parenthesis) basedon whether the individual in-chip horizontal transmission track segment1004 to which the output node of the buffer 1012 is defective oroperational and based on a user design indicating for the buffer 1012 tobe in a pass-through state or a high impedance output state. Variouslogic can implement such a table.

TABLE 1 User Design for 1004-R(1004-L) 1012(1022) Output of 1012(1022)(1) Defective X High Impedance (2) Operational Decouple High Impedance(3) Operational Pass-Through Output of Multiplexer 1010(1020)

FIG. 11 illustrates, conceptually, a clock tree 1102 in a chip stackaccording to some examples. The clock tree 1102 is described in thecontext of the PL ICs described above; however, concepts described withrespect to the clock tree 1102 are applicable to, e.g., non-programmableASICs and/or a combination of programmable and non-programmable ASICs,where the clock tree 1102 may be routes that are hardwired andnon-programmable in the chip stack or where the clock tree 1102 may inpart be programmable and in other parts be hardwired andnon-programmable in the chip stack. Components that are programmed toimplement the aspects described herein can be hardwired andnon-programmable to likewise implement those aspects.

As described with respect to FIG. 9, in-chip routing of a clock tree toleaf level(s) that operate on a same clock signal provided by the clocktree is contained (e.g., wholly contained) within one logical chip. FIG.11 illustrates a clock tree 1102 that is contained within one logicalchip, which is two physical chips in the illustrated example. In otherinstances, one logical chip may be more than two physical chips. Asillustrated, in-chip routing of the clock tree 1102 to leaf level(s) iscontained within one logical chip because, from a branching point 1103of the clock tree 1102 in the fabric chip 104, each branch of the clocktree 1102 has corresponding in-chip routing within a same physical chipto out-of-chip routing at respective generally same in-chip locations(e.g., in sliver 1122-1 and in sliver 1122-2) within that physical chipfollowed by corresponding in-chip routing within another same physicalchip until the leaf level(s) at the out-of-chip leaf-level connectionbridges 1132 are reached.

FIG. 11 shows the fabric chips 104-108 including slivers 1120-1, 1120-2,1120-3 (collectively or individually, sliver(s) 1120) of clock regions310 and slivers 1122-1, 1122-2, 1122-3 (collectively or individually,sliver(s) 1122) of out-of-chip routing bridges 1002. The slivers 1120and slivers 1122 alternate in the illustrated example. Each fabric chip104-108 includes one or more clock region 310 in a respective sliver1120 of clock regions 310. The clock regions 310 of the fabric chips104-108 within a respective sliver 1120 can be physically and/orlogically aligned. Similarly, each fabric chip 104-108 includes anout-of-chip routing bridge 1002 in a respective sliver 1122 ofout-of-chip routing bridges 1002. The out-of-chip routing bridges 1002of the fabric chips 104-108 within a respective sliver 1122 can bephysically and/or logically aligned.

The base chip 102 includes a clock source circuit 1112. The clock sourcecircuit 1112 is configured to generate a clock signal to be routed bythe clock tree 1102. From the clock source circuit 1112, the clock tree1102 includes out-of-chip routing from the base chip 102 to the fabricchip 104. In the context of FIG. 6, this can be implemented by the clocksource circuit 1112 having an output node electrically connected to ametal stack 604. A buffer 614-4 on the fabric chip 104 that has an inputnode electrically connected to the metal stack 604 can be programmed toa pass-through state, while other buffers 614 that have respective inputnodes electrically connected to the metal stack 604 are programmed to ahigh impedance output state.

The clock tree 1102 is then in-chip routed wholly within one logicalchip, which includes portions of the fabric chips 104, 106. The clocktree 1102 includes multiple (e.g., three) branches 1104 a, 1104 b, 1104c in the in-chip routing. In the context of FIGS. 5-7, the in-chiprouting of the clock tree 1102 can be implemented by in-chip horizontaltransmission tracks 502 (e.g., including an appropriate individualin-chip transmission track 610-4) and in-chip vertical transmissiontracks 504, e.g., for long reaches across the fabric chips 104, 106(e.g., across many clock regions 310). Turns, intersections, branching,etc., of or between the in-chip horizontal transmission tracks 502 andin-chip vertical transmission tracks 504 can be implemented usingappropriate bidirectional buffers 710 in respective clock regions 310.The in-chip routing can further be implemented by in-chip horizontaldistribution tracks 506 and in-chip vertical distribution tracks 508,e.g., for moderate reaches across the fabric chip 104 (e.g., across oneor a few clock regions 310). The in-chip horizontal distribution tracks506 and in-chip vertical distribution tracks 508 can be electricallyconnected to appropriate ones of the in-chip horizontal transmissiontracks 502 and in-chip vertical transmission tracks 504, and variousturns and intersections can be implemented, by buffers 714, 716 atappropriate clock regions 310. At a respective clock region 310 thatincludes the leaf nodes of the fabric chip 104 that operate using orconsume the clock signal of the clock tree 1102, the clock tree 1102includes an appropriate in-chip horizontal distribution track 506 (e.g.,individual in-chip horizontal distribution track segment 802).

The clock tree 1102 includes out-of-chip routing between the fabricchips 104, 106. This out-of-chip routing is implemented by out-of-chiprouting bridges 1002 in the fabric chips 104, 106 in the sliver 1122-1and in sliver 1122-2. In the context of sliver 1122-1 and referring toFIG. 10, each branch of the clock tree 1102 includes a correspondingindividual in-chip horizontal transmission track segment 1004-L-4, andthe corresponding buffers 1012-4, 1022-4, 1022-6 are programmed to be ina high impedance output state. The multiplexer 1010-6 is programmed topass the signal from the underlying chip (e.g., the fabric chip 104),and the buffer 1012-6 is programmed in a pass-through state. In thecontext of sliver 1122-2 and referring to FIG. 10, each branch of theclock tree 1102 includes a corresponding individual in-chip horizontaltransmission track segment 1004-L-6, and the corresponding buffers1022-6, 1022-4 are programmed to be in a high impedance output state.The multiplexer 1010-4 is programmed to pass the signal from theoverlying chip (e.g., the fabric chip 106), and the buffer 1012-4 isprogrammed in a pass-through state. Between and after the slivers1122-1, 1122-2 the clock tree 1102 continues the in-chip routing. Afterthe in-chip routing, the clock tree 1102 reaches the out-of-chipleaf-level connection bridges 1132, which are connected to the clocktree 1102 at the leaf level, like in FIG. 9.

From the branching point 1103 of the clock tree 1102, each branch 1104a, 1104 b, 1104 c of the clock tree 1102 has corresponding in-chiprouting within the fabric chip 104 to out-of-chip routing at the sliver1122-1 in the fabric chip 104. Each branch 1104 a, 1104 b, 1104 c isrouted by out-of-chip routing in the sliver 1122-1 to the fabric chip106, and then has corresponding in-chip routing within the fabric chip106 to out-of-chip routing at the sliver 1122-2 in the fabric chip 106.Each branch 1104 a, 1104 b, 1104 c is then routed by out-of-chip routingin the sliver 1122-2 to the fabric chip 104, and thereafter hascorresponding in-chip routing within the fabric chip 104 to the leaflevels including the out-of-chip leaf-level connection bridges 1132.This routing is therefore contained within one logical chip. Althoughout-of-chip routing may be by using different physical structures suchthat the out-of-chip routing is not an exact same in-chip location foreach of the branches 1104 a, 1104 b, 1104 c, each of the correspondinginstances of out-of-chip routing for the branches 1104 a, 1104 b, 1104 coccurs in a same sliver (e.g., sliver 1122-1 or sliver 1122-2) such thatin-chip locations of out-of-chip routing are generally the same.Further, as an example of routing not being contained within one logicalchip, if branch 1104 a is routed by out-of-chip routing at sliver 1122-1to the fabric chip 108 and subsequently routed by in-chip routing in thefabric chip 108 to sliver 1122-2 while the branches 1104 b, 1104 c arerouted as described above and illustrated in FIG. 11, the in-chiprouting would not be contained within one logical chip.

Implementing the slivers 1122 of out-of-chip routing bridges 1002permits the in-chip routing of a clock tree to bypass a region, such asregion 1124, that has a defect that would prevent in-chip routingthrough the region. In some instances, a clock tree can be in-chiprouted around a defective region, and the slivers 1122 provideadditional flexibility to route the clock tree out-of-chip whilemaintaining in-chip routing within one logical chip. The clock tree 1102is shown to have in-chip routing that begins and concludes in the fabricchip 104, and in other examples, the in-chip routing could conclude inanother chip and can have out-of-chip routing through more chips. Manypermutations of the in-chip routing through many chips (while beingcontained within one logical chip) can be implemented.

Implementing the routing shown in FIG. 11 can also include using activedeskewing of a clock signal on the clock tree. Routing of the clock treein different physical chips (although one logical chip) can result inthe clock signal incurring different intra-wafer variation on thedifferent physical chips, which can cause the clock signal on the clocktree to incur a different skew. An active deskew can accommodate thisskew from routing in different physical chips. Distributed phasedetectors and delay lines can tune and/or equalize delays between thedifferent clock regions, thus nulling out the process variationcomponent of the clock skew up to the leaf level.

The architecture described herein further permits routing of a clocktree from a clock source (e.g., clock source circuit 1112) in-chip andout-of-chip in any chip of the chip stack. Whether the clock tree ishardwired in an ASIC implementation or programmed in a programmableimplementation, a clock signal sourced on, e.g., the base chip 102 canreach any fabric chip 104-108, can be routed on any of the chips 102-108and still reach all the same loads on any of the chips 102-108.Respective clock networks on fabric chips 104-108 can be used forrouting interchangeably since those clock networks are all programmablyshorted together at the leaf level.

FIG. 12 is a flowchart of a method 1200 of forming the multi-chip deviceof FIG. 1 according to some examples. The processing of the method 1200of FIG. 12 is generally described, and a person having ordinary skill inthe art will readily understand the more specific processing that can beperformed. The more specific processing can be according to anysemiconductor processing for forming an IC on a substrate, which is tobe singulated into a chip. For ease of description herein, a wafer onwhich one or more base chips 102 are formed is referred to as a basewafer, and a wafer on which one or more fabric chips 104, 106, 108 areformed is referred to as a fabric wafer. Any wafer can be any shapeand/or size.

At block 1202, front side processing for chips on the respective wafersis performed. For example, front side processing of each semiconductorsubstrate 112, 114, 116, 118 (e.g., wafer) can include forming devices(e.g., transistors 142, 144, 146, 148) in and/or on the front surface ofthe semiconductor substrate 112, 114, 116, 118, and forming front sidedielectric layer(s) 122, 124, 126, 128 with metallizations and frontside bond pads 152, 154, 156, 158 on the front surface of thesemiconductor substrate 112, 114, 116, 118. Multiple base chips 102 canbe formed on a base wafer. Multiple fabric chips 104, 106, or 108 can beformed on each of a plurality of fabric wafers.

At block 1204, a base wafer is bonded to a first fabric wafer, such asfront side to front side bonding as shown in FIG. 1. As a result of thebonding, a front side of a base chip 102 is bonded to a front side of afabric chip 104, as shown in FIG. 1. The bonding can be hybrid bonding,such as bonding front side bond pads 152 on the base wafer to front sidebond pads 154 on the first fabric wafer, and bonding the exteriorsurface of the front side dielectric layer(s) 122 on the base wafer tothe exterior surface of the front side dielectric layer(s) 124 on thefirst fabric wafer.

At block 1206, the semiconductor substrate of the first fabric wafer isthinned from a backside of the first fabric wafer. As show in FIG. 1,the semiconductor substrate 114 of the fabric chip 104 is thinned fromthe backside. The thinning can be by a chemical mechanical polish (CMP)or other appropriate process. At block 1208, backside processing forfabric chips on the first fabric wafer is performed. As illustrated byFIG. 1, the backside processing can include forming backside TSVs 164through the semiconductor substrate 114 of the first fabric wafer andconnecting to metallization in the front side dielectric layer(s) 124 onthe first fabric wafer. The backside processing can further includeforming backside dielectric layer(s) 134 with metallizations andbackside bond pads 174 on the backside of the semiconductor substrate114. The metallizations in the backside dielectric layer(s) 134 can beelectrically connected to the metallizations in the front sidedielectric layer(s) 124 through the backside TSVs 164.

At block 1210, the first fabric wafer is bonded to a second fabricwafer, such as backside to front side bonding as shown in FIG. 1. As aresult of the bonding, a backside of a fabric chip 104 is bonded to afront side of a fabric chip 106, as shown in FIG. 1. The bonding can behybrid bonding, such as bonding backside bond pads 174 on the firstfabric wafer to front side bond pads 156 on the second fabric wafer, andbonding the exterior surface of the backside dielectric layer(s) 134 onthe first fabric wafer to the exterior surface of the front sidedielectric layer(s) 126 on the second fabric wafer.

At block 1212, the semiconductor substrate of the second fabric wafer isthinned from a backside of the second fabric wafer, like described withrespect to block 1206. As show in FIG. 1, the semiconductor substrate116 of the fabric chip 106 is thinned from the backside.

At block 1214, backside processing for fabric chips on the second fabricwafer is performed, like described with respect to block 1208. Asillustrated by FIG. 1, the backside processing can include formingbackside TSVs 166 through the semiconductor substrate 116 of the secondfabric wafer and connecting to metallization in the front sidedielectric layer(s) 126 on the second fabric wafer. The backsideprocessing can further include forming backside dielectric layer(s) 136with metallizations and backside bond pads 176 on the backside of thesemiconductor substrate 116. The metallizations in the backsidedielectric layer(s) 136 can be electrically connected to themetallizations in the front side dielectric layer(s) 126 through thebackside TSVs 166.

At block 1216, the second fabric wafer is bonded to a third fabricwafer, such as backside to front side bonding as shown in FIG. 1. As aresult of the bonding, a backside of a fabric chip 106 is bonded to afront side of a fabric chip 108, as shown in FIG. 1. The bonding can behybrid bonding, such as bonding backside bond pads 176 on the secondfabric wafer to front side bond pads 158 on the third fabric wafer, andbonding the exterior surface of the backside dielectric layer(s) 136 onthe second fabric wafer to the exterior surface of the front sidedielectric layer(s) 128 on the third fabric wafer.

At block 1218, the semiconductor substrate of the base wafer is thinnedfrom a backside of the base wafer, like described with respect to block1206. As show in FIG. 1, the semiconductor substrate 112 of the basechip 102 is thinned from the backside.

At block 1220, backside processing for base chips on the base wafer isperformed, like described with respect to block 1208. As illustrated byFIG. 1, the backside processing can include forming backside TSVs 162through the semiconductor substrate 112 of the base wafer and connectingto metallization in the front side dielectric layer(s) 122 on the basewafer. The backside processing can further include forming backsidedielectric layer(s) 132 with metallizations and exterior connectorbackside pads 172 on the backside of the semiconductor substrate 112.The metallizations in the backside dielectric layer(s) 132 can beelectrically connected to the metallizations in the front sidedielectric layer(s) 122 through the backside TSVs 162. The backsideprocessing for the base chips 102 can further include forming thepassivation layer 180 and external connectors 182. At block 1222, thebonded wafers are singulated (e.g., by sawing) to separate individualmulti-chip devices that have been formed. Each of the multi-chip devicescan be as shown in FIG. 1.

The various operations of blocks of the method 1200 can be repeatedand/or omitted to form various multi-chip devices. The method 1200 hasbeen provided as an example of how some multi-chip devices can beformed. In other examples, some operations can be performed in parallel.For example, multiple different wafer stacks can be formed (e.g., bybonding and processing respective wafers) in parallel before themultiple different wafer stacks are then bonded together and furtherprocessed to form the multi-chip devices. A person having ordinary skillin the art will readily understand how to form other multi-chip devicesbased on the description of the method 1200 above.

FIG. 13 is a flowchart of a method 1300 of operating a multi-chip deviceaccording to some examples. The multi-chip device can be as shown in anyof the foregoing figures, for example. At block 1302, optionally, a chipstack is programmed to instantiate a clock tree in a programmable clockrouting network of the chip stack. In foregoing examples, theprogrammable clock routing network can be programmed with theprogramming of PL ICs, such as by using a configuration interconnect.The programming can include programming configuration memory to programbuffers 614, 622, 624, 626, 628, 714, 716, 720, 724, 1012, 1022,bidirectional buffers 710, multiplexers 1010, 1020, and/or any otherprogrammable element of the programmable clock routing network. Block1302 can be omitted where the chip stack includes one or more hardwiredand/or non-programmable clock trees, for example.

At block 1304, a clock signal is propagated along the clock tree in thechip stack. For example, the clock signal can be generated in a clocksource circuit, such as clock source circuit 912, 914, 1112, andpropagated through a clock tree 902, 904, 1102 to a leaf level. Theclock tree 902, 904, 1102 has in-chip routing contained within onelogical chip of the chip stack. The clock tree 902, 904, 1102 iselectrically connected to out-of-chip leaf-level connection bridges 922,924, 1132, as described above.

While the foregoing is directed to specific examples, other and furtherexamples may be devised without departing from the basic scope thereof,and the scope thereof is determined by the claims that follow.

What is claimed is:
 1. A multi-chip device comprising: a chip stackcomprising chips, the chip stack comprising a clock tree, in-chiprouting of the clock tree being contained within one logical chip of thechip stack, the chip stack comprising leaf nodes disposed in respectivechips, each leaf node of the leaf nodes being electrically connected tothe clock tree through a respective leaf-level connection bridge, therespective leaf-level connection bridge extending in an out-of-chipdirection through a plurality of the chips.
 2. The multi-chip device ofclaim 1, wherein the one logical chip is one physical chip of the chips.3. The multi-chip device of claim 1, wherein the one logical chipincludes respective portions of two or more of the chips.
 4. Themulti-chip device of claim 1, wherein the clock tree includes routingthrough an out-of-chip routing bridge in an out-of-chip directionelectrically connected between a first in-chip routing segment of afirst chip of the chips and a second in-chip routing segment of a secondchip of the chips, the second chip being different from the first chip.5. The multi-chip device of claim 1, wherein the clock tree includesmultiple in-chip routing branches contained within the one logical chip.6. The multi-chip device of claim 1, wherein a first chip of the chipsincludes a clock source circuit electrically connected to out-of-chiprouting to a second chip of the chips, the second chip having an in-chiprouting segment of the in-chip routing that is electrically connected tothe out-of-chip routing, the clock source circuit being configured tooutput a clock signal to the clock tree via the out-of-chip routing. 7.A multi-chip device comprising: a chip stack comprising chips, the chipstack comprising a programmable clock routing network, programmableleaf-level connection bridges being disposed in the chip stack andelectrically connected to the programmable clock routing network, theprogrammable leaf-level connection bridges extending in an out-of-chipdirection through a plurality of the chips and electrically connected torespective leaf nodes in each chip of the plurality of the chips.
 8. Themulti-chip device of claim 7, wherein the chip stack is configurable toimplement a clock tree in the programmable clock routing network within-chip routing in any chip of a plurality of the chips of the chipstack, the in-chip routing of the clock tree being contained within onelogical chip of the chip stack, the chip stack further beingconfigurable to electrically connect, via the programmable leaf-levelconnection bridges, leaf nodes on different chips of the chip stack tothe clock tree.
 9. The multi-chip device of claim 7, wherein the chipstack includes a metal stack electrically connected to a clock sourcecircuit, the metal stack extending in an out-of-chip direction, eachchip of the chip stack in which at least a portion of the programmableclock routing network is disposed comprising an in-chip routing segmentof the programmable clock routing network that is programmablyelectrically connected to the metal stack.
 10. The multi-chip device ofclaim 7, wherein each programmable leaf-level connection bridge of theprogrammable leaf-level connection bridges includes: a leaf-levelconnection node extending in the out-of-chip direction through theplurality of the chips; for each chip of the plurality of the chips: afirst selective transmitting circuit having an input node electricallyconnected to an in-chip routing segment and having an output nodeelectrically connected to the leaf-level connection node, the in-chiprouting segment being disposed in the respective chip and forming a partof the programmable clock routing network; and a second selectivetransmitting circuit having an input node electrically connected to theleaf-level connection node and having an output node electricallyconnected to a leaf-level track, the leaf-level track being electricallyconnected to a leaf node disposed in the respective chip.
 11. Themulti-chip device of claim 7, wherein the programmable clock routingnetwork includes programmable routing bridges connected electricallybetween chips of the chip stack.
 12. The multi-chip device of claim 11,wherein each programmable routing bridge of the programmable routingbridges includes, disposed in a respective chip of the chips, a firstmultiplexer, a first selective transmitting circuit, a secondmultiplexer, and a second selective transmitting circuit, wherein: afirst in-chip routing segment of the programmable clock routing networkis disposed in the respective chip, the first in-chip routing segmentbeing electrically connected to a first input node of the firstmultiplexer and to an output node of the second selective transmittingcircuit; a second in-chip routing segment of the programmable clockrouting network is disposed in the respective chip, the second in-chiprouting segment being electrically connected to a first input node ofthe second multiplexer and to an output node of the first selectivetransmitting circuit; a third in-chip routing segment of theprogrammable clock routing network is disposed in another chip overlyingor underlying the respective chip, the third in-chip routing segmentbeing electrically connected to a second input node of the firstmultiplexer; a fourth in-chip routing segment of the programmable clockrouting network is disposed in the other chip, the fourth in-chiprouting segment being electrically connected to a second input node ofthe second multiplexer; an output node of the first multiplexer iselectrically connected to an input node of the first selectivetransmitting circuit; and an output node of the second multiplexer iselectrically connected to an input node of the second selectivetransmitting circuit.
 13. A method of operating a multi-chip device, themethod comprising: propagating a clock signal along a clock tree in achip stack, the chip stack comprising chips, in-chip routing of theclock tree being contained within one logical chip of the chip stack,the chip stack comprising leaf nodes disposed in respective chips, eachleaf node of the leaf nodes being electrically connected to the clocktree through a respective leaf-level connection bridge, the respectiveleaf-level connection bridge extending in an out-of-chip directionthrough a plurality of the chips.
 14. The method of claim 13, whereinthe one logical chip is one physical chip.
 15. The method of claim 13,wherein the one logical chip includes respective portions of two or moreof the chips.
 16. The method of claim 13, wherein the clock treeincludes routing through a routing bridge in an out-of-chip directionelectrically connected between a first in-chip routing segment of afirst chip of the chips and a second in-chip routing segment of a secondchip of the chips, the second chip being different from the first chip.17. The method of claim 13 further comprising programming the chip stackto instantiate the clock tree in a programmable clock routing network ofthe chip stack.
 18. The method of claim 17, wherein programming the chipstack to instantiate the clock tree includes programming a programmableinterconnection between a metal stack and an in-chip routing segment ofthe programmable clock routing network, the metal stack extending in anout-of-chip direction in the chip stack.
 19. The method of claim 17,wherein programming the chip stack to instantiate the clock treeincludes programming programmable routing bridges electrically connectedbetween neighboring chips of the chip stack, the programmable clockrouting network including the programmable routing bridges.
 20. Themethod of claim 17, wherein programming the chip stack to instantiatethe clock tree includes programming the leaf-level connection bridges,the programmable clock routing network being electrically connected tothe leaf-level connection bridges.